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My top secret development (Patreon)

Published:
2019-01-12 21:42:18
Edited:
2019-01-12 21:43:07
Imported:
2026-11

Content

It's an esp programmer. It's the first time I soldered a qfn package. I simply used hot air and enough flux just like I learned from Louis Rossman. Unfortunately the LDO is getting hot as soon I connect it to USB.. debugging next week. I hope I did the routing right and its just a rotated chip or a bridge..

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Comments

Unexpected Maker

Nooooooooo!!!!!!!!!!!! Any shorts? Debug now!!!!! It looks awesome.. I hope you sort out why it's not working :(

bitluni

I'm not at home 😁 I even missed an appointment yesterday since I really couldn't wait an soldered it quickly. I'll take my time on Monday to solder another one part by part and measure the traces if the schematic doesn't show a brainfart

Andy Gaffney

I've been wondering how best to do this myself. I was going to try and convert a mini oven into a temp-controlled one and try the reflow method using solder paste. I'll wait and see how you get on. Good Luck!

123

Build one PCB without the QFN and check if everything is fine/expected. Then you can solder QFN. For such type of developments I'm usually creating larger hole under the thermal pad in order to have option to solder it without hot air, just with soldering iron - first pads, then thermal pad. Usually works pretty well.